Title:
【発明の名称】電子部品の樹脂封止成形方法
Document Type and Number:
Japanese Patent JP2666041
Kind Code:
B2
Inventors:
Kazuhiko Bando
Application Number:
JP34314193A
Publication Date:
October 22, 1997
Filing Date:
December 14, 1993
Export Citation:
Assignee:
Towa Corporation
International Classes:
B29C45/02; H01L21/56; (IPC1-7): H01L21/56; B29C45/02
Domestic Patent References:
| JP59220931A |