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Patent Searching and Data


Title:
【発明の名称】ボンディング方法及びその装置
Document Type and Number:
Japanese Patent JP2687015
Kind Code:
B2
Inventors:
Bando Akio
Zushi
Michio Okamoto
Masaki Nakanishi
Application Number:
JP17802089A
Publication Date:
December 08, 1997
Filing Date:
July 12, 1989
Export Citation:
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Assignee:
株式会社新川
株式会社日立製作所
International Classes:
H01L21/52; H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
JP2105549A
JP58139A
Attorney, Agent or Firm:
Yoshinori Tanabe