Title:
【発明の名称】傾斜コンタクトエッチ方法
Document Type and Number:
Japanese Patent JP2711538
Kind Code:
B2
Abstract:
The process described provides a sloped contact etch. The process has the steps of: etching a substrate 12 then removing the polymer that is produced during the substrate 12 etch. These two steps are alternated until a desired depth is reached. Next, the resist 11 is etched followed by an etch of the substrate 12. This is then repeated until the required depth is reached. By varying the duration and repetition of the etches, the slope of the etch can be regulated.
Inventors:
Robert Kay Berglund
Carl E. Morts
Roger Tildesley
Carl E. Morts
Roger Tildesley
Application Number:
JP26189687A
Publication Date:
February 10, 1998
Filing Date:
October 19, 1987
Export Citation:
Assignee:
Motorola Incorporated
International Classes:
H01L21/3065; H01L21/308; H01L21/302; H01L21/311; H01L21/768; (IPC1-7): H01L21/3065
Domestic Patent References:
| JP6197824A | ||||
| JP5874042A | ||||
| JP5350684A | ||||
| JP53125768A | ||||
| JP5519881A |
Attorney, Agent or Firm:
Yoshiaki Ikeuchi