Title:
【発明の名称】樹脂封止型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2714002
Kind Code:
B2
Inventors:
Kenji Miyajima
Application Number:
JP15462388A
Publication Date:
February 16, 1998
Filing Date:
June 24, 1988
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/56; H01L23/50; (IPC1-7): H01L23/50; H01L21/56
Domestic Patent References:
| JP62147358U |
Attorney, Agent or Firm:
Norio Ogo