Title:
【発明の名称】電子部品搭載用基板の製造方法
Document Type and Number:
Japanese Patent JP2717313
Kind Code:
B2
Inventors:
Naoto Ishida
Application Number:
JP23239289A
Publication Date:
February 18, 1998
Filing Date:
September 07, 1989
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01R43/00; H01L23/50; H05K3/30; H05K3/34; (IPC1-7): H01L23/50; H01R9/09; H01R43/00
Attorney, Agent or Firm:
Yoshiyasu Takahashi