Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2738602
Kind Code:
B2
Inventors:
TOMINAGA ATSUSHI
Application Number:
JP14672091A
Publication Date:
April 08, 1998
Filing Date:
May 20, 1991
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
H01L27/06; H01L21/301; H01L21/8249; (IPC1-7): H01L21/8249; H01L21/301; H01L27/06
Domestic Patent References:
| JP55145371A | ||||
| JP60167458A | ||||
| JP6136964A | ||||
| JP1150349A |
Attorney, Agent or Firm:
Kenichi Hayase