Title:
【発明の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JP2748443
Kind Code:
B2
Inventors:
MIKAGI IKU
Application Number:
JP26656488A
Publication Date:
May 06, 1998
Filing Date:
October 22, 1988
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/768; (IPC1-7): H01L21/768
Attorney, Agent or Firm:
Suzuki Akio