Title:
【発明の名称】粉末射出形成用コンパウンドの作製方法
Document Type and Number:
Japanese Patent JP2749699
Kind Code:
B2
Abstract:
PURPOSE:To manufacture excellent compound for injection-molding by preliminarily kneading raw material powder with a part of high polymer binder in an organic solvent and heating and kneading the residual binder component after applying resin on the surface at the time of manufacturing the compound for powder injection-molding. CONSTITUTION:At the time of manufacturing the compound for injection-molding using powders of metal and cement or ceramic as the raw material, the raw material powder is kneaded with material adding the high polymer binder of binding agent, plasticizer, lubricant, etc., to the organic solvent of ketone group, aromatic group, etc., to apply the resin on surface of the raw material powder. Successively, this powder is dried and mixed with the residual binder component, and by heating and kneading them, the raw material powder and the binder component are uniformly dispersed and mixed, and by sintering after injection- molding, the compound for obtaining the product having high density and excellent dimensional accuracy, is obtd.
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Inventors:
KURIMURA KENJI
KASAI TAKAO
SAITO SHIGERU
OGASAWARA NAOTO
YOSHIOKA KENICHI
HOSHI MASAMI
NAKAMURA SEIICHI
KASAI TAKAO
SAITO SHIGERU
OGASAWARA NAOTO
YOSHIOKA KENICHI
HOSHI MASAMI
NAKAMURA SEIICHI
Application Number:
JP9826090A
Publication Date:
May 13, 1998
Filing Date:
April 13, 1990
Export Citation:
Assignee:
SHICHIZUN TOKEI KK
International Classes:
C04B35/628; B22F1/00; B22F1/02; B22F3/02; B28B1/24; C04B35/00; (IPC1-7): B22F3/02; B22F1/00; B22F1/02; B28B1/24; C04B35/628
Domestic Patent References:
| JP5432106A | ||||
| JP1281707A |