Title:
【発明の名称】集積回路の封止方法
Document Type and Number:
Japanese Patent JP2759083
Kind Code:
B2
Abstract:
PCT No. PCT/FR87/00143 Sec. 371 Date Dec. 29, 1987 Sec. 102(e) Date Dec. 29, 1987 PCT Filed Apr. 29, 1987 PCT Pub. No. WO87/06763 PCT Pub. Date Nov. 5, 1987.To encapsulate integrated circuits mounted on continuous dielectrical strips (surface-mounted circuits) it is proposed to transfer mold a thermosetting resin around circuits carried by the strip, the resin being injected outside the parting plane of the mold, contrary to the usual practice in this field. The protection of the circuits is improved while, at the same time, the ability to test the strip is preserved.
Inventors:
SUTEFUAN FURANSHISU
RABERU JAN
RABERU JAN
Application Number:
JP50280087A
Publication Date:
May 28, 1998
Filing Date:
April 29, 1987
Export Citation:
Assignee:
ESU JEE ESU TOMUSON MIKUROEREKUTORONIKUSU SA
International Classes:
B29C45/14; B29C70/72; H01L21/56; (IPC1-7): H01L21/56
Domestic Patent References:
| JP4913116B1 | ||||
| JP5837692B2 |
Foreign References:
| FR2520541A1 |
Attorney, Agent or Firm:
Keiko Okabe