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Title:
【発明の名称】断面加工観察装置
Document Type and Number:
Japanese Patent JP2811073
Kind Code:
B2
Abstract:
An apparatus for effecting preparation and observation of a topographic section in a particular region of a sample. The apparatus includes: a sample chamber for containing a sample, an ion beam irradiation unit mounted in the sample chamber for irradiating the sample with a scanned ion beam to groove the particular region to thereby prepare the topographic section, an electron beam irradiation unit mounted in the sample chamber for irradiating the topographic section with a scanned electron beam, the electron beam irradiation unit being arranged relative to the ion beam irradiation unit such that the electron beam intersects the ion beam at the particular region at an angle not exceeding 90 DEG , a detector for detecting secondary electrons released from the sample upon irradiation with the ion beam and the electron beam, a beam switching circuit operable during the course of the preparation of the topographic section for temporarily switching from the ion beam to the electron beam, and a display connected to the detector and operative in response to the switching for displaying an image of the topographic section based on the detection of the secondary electrons released by the irradiation with the electron beam to thereby temporarily observe the topographic section during the course of the preparation thereof.

Inventors:
Adachi Tatsuya
Takashi Minato
Application Number:
JP27803688A
Publication Date:
October 15, 1998
Filing Date:
November 01, 1988
Export Citation:
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Assignee:
Seiko Instruments Co., Ltd.
International Classes:
G01N23/22; G01N1/32; G01Q30/02; G01Q30/04; G01Q30/18; H01J37/28; H01J37/305; H01L21/66; (IPC1-7): H01L21/66; G01N23/22
Domestic Patent References:
JP5299495A
JP59169133A
JP6124136A
JP59163505A
Attorney, Agent or Firm:
Keinosuke Hayashi