Title:
【発明の名称】ヘテロ接合バイポーラ半導体装置
Document Type and Number:
Japanese Patent JP2811327
Kind Code:
B2
Inventors:
Takahashi Go
Application Number:
JP22304989A
Publication Date:
October 15, 1998
Filing Date:
August 31, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L29/73; H01L21/331; H01L29/205; H01L29/737; (IPC1-7): H01L21/331; H01L29/205; H01L29/73
Domestic Patent References:
| JP56120170A | ||||
| JP60244065A |
Attorney, Agent or Firm:
Shoji Kashiwaya (1 person outside)