Title:
【発明の名称】セラミックス多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP2884682
Kind Code:
B2
Inventors:
YOKOGAWA SAKAE
Application Number:
JP8416090A
Publication Date:
April 19, 1999
Filing Date:
March 30, 1990
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Domestic Patent References:
| JP58114496A | ||||
| JP63306693A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)