Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2885942
Kind Code:
B2
Inventors:
YAMANISHI JUJI
TANIDA HIROSHI
YAMAGUCHI SEIKI
SHINDO HIROYUKI
UNO TOSHIHIKO
KAWASAKI HIDEO
TANIDA HIROSHI
YAMAGUCHI SEIKI
SHINDO HIROYUKI
UNO TOSHIHIKO
KAWASAKI HIDEO
Application Number:
JP40814290A
Publication Date:
April 26, 1999
Filing Date:
December 27, 1990
Export Citation:
Assignee:
MATSUSHITA DENSHI KOGYO KK
International Classes:
H01L29/78; H01L21/336; (IPC1-7): H01L29/78; H01L21/336
Domestic Patent References:
| JP6441268A | ||||
| JP59130472A | ||||
| JP5731864U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)