Title:
【発明の名称】ウエハキャリアの精密洗浄装置
Document Type and Number:
Japanese Patent JP2918048
Kind Code:
B2
Abstract:
PURPOSE:To uniformly clean a whole wafer groove by a method wherein a total width of brushes sandwiching a rotation means is formed to be narrower than a width of a wafer carrier and the brushes can be moved in an up-and- down direction and a horizontal direction and can be turned in a forward direction and a reverse direction. CONSTITUTION:A wafer carrier 1 is fixed in a position faced with a brush axial line inside a water tank filled with pure water; an end face of one brush 36a is positioned at the upper part of a position coming into slight pressure- contact with one side face 5a; while the brush is being turned forward, it is lowered down to the bottom of the wafer carrier 1 and is raised in succession; wafer grooves 6 and wall faces in parts coming into contact with the brush 36a are cleaned. Then, the brush 36a is reversed and the same cleaning operation is executed; the brush is moved further; an end face of the other brush 36b is situated at the upper part of a position coming into slight pressure-contact with the other side wall 5b; the same cleaning operation is executed. Thereby, the whole surface of the wafer carrier is cleaned; all the wafer grooves can be cleaned uniformly and cleanly; it is possible to surely prevent a wafer from being contaminated.
Inventors:
UMEZAWA KOICHI
SAITO HARUMITSU
FUJE NOBUO
SONODA HIROAKI
SAITO HARUMITSU
FUJE NOBUO
SONODA HIROAKI
Application Number:
JP29513189A
Publication Date:
July 12, 1999
Filing Date:
November 15, 1989
Export Citation:
Assignee:
EBARA SEISAKUSHO KK
FUJITSU KK
FUJITSU KK
International Classes:
C30B35/00; H01L21/304; B08B1/04; (IPC1-7): H01L21/304; B08B1/04; C30B35/00
Domestic Patent References:
| JP5796531A | ||||
| JP60146340U | ||||
| JP62124848U |
Attorney, Agent or Firm:
Toshitada Takahashi (1 outside)