Title:
【発明の名称】電子部品の樹脂封止成形方法及び装置
Document Type and Number:
Japanese Patent JP2932136
Kind Code:
B2
Inventors:
BANDO KAZUHIKO
Application Number:
JP20268993A
Publication Date:
August 09, 1999
Filing Date:
July 22, 1993
Export Citation:
Assignee:
TOOWA KK
International Classes:
B29C45/02; B29C45/14; B29C45/26; B29C45/76; H01L21/56; B29K105/20; B29L31/34; (IPC1-7): B29C45/14; B29C45/02; B29C45/26; B29C45/76; H01L21/56
Domestic Patent References:
| JP61148016A | ||||
| JP428514A | ||||
| JP1269512A | ||||
| JP1186638A | ||||
| JP4353410A | ||||
| JP6262435U |