Title:
【発明の名称】半導体チップのワイヤレスボンディング方法
Document Type and Number:
Japanese Patent JP2941533
Kind Code:
B2
Abstract:
PURPOSE:To utilize an existing assembling line without using means such as a tape carrier by eliminating a gold bump forming step in a semiconductor chip, to further omit a die bonding step and a wire bonding step and to shorten a leading time by employing a system for forming a gold bump directly on a lead. CONSTITUTION:A system for forming a gold bump 6 directly on a lead 9 by utilizing a bonding step. As a result, in addition to shortening of a leading time, a conventional assembling line can be coped with merely by altering a design of inner leads of a lead frame.
Inventors:
AKAMA MITSUYOSHI
Application Number:
JP32933991A
Publication Date:
August 25, 1999
Filing Date:
December 13, 1991
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60; H01L21/603
Domestic Patent References:
| JP3233934A | ||||
| JP62257750A | ||||
| JP63104431A | ||||
| JP2298044A |
Attorney, Agent or Firm:
Norio Ogo