【発明の名称】水性離型剤

Japanese Patent JP2972824

B2

The present invention provides an aqueous mold-releasing agent which exhibits an excellent mold-releasing property with a small applied amount thereof without causing roughed surfaces of molded articles. Said agent comprises at least one of the fluorine-containing sulfonates in combination with a wax and/or a silicone oil, said sulfonates being represented by the following formula (I): (XSO3) l M (I> ,wherein X is any one of the following fluorine-containing groups: and CmF2m+1(CH2)n-(n:0 - 2, m:1 - 12), M is an alkali metal, an alkaline earth metal, zinc, an alkylamine, an alkanolamine or ammonium and l is 1 or 2.

JPH06143296	MOLDING METHOD FOR RESIN AND MOLD THEREFOR
JP4196033	A resin composition for mold release treatment and a method for manufacturing a sealed semiconductor device using the resin composition.

BUTSUGAN KIMYA
KOHAMA HIROYUKI
TACHIIRI NOBUHIKO
HIGO MISAKO

JP31252890A

November 08, 1999

November 16, 1990

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NEOSU KK

B29C33/62; B29C33/64; C09K3/00; B29K75/00; (IPC1-7): B29C33/62; C09K3/00

Aoyama Ryo (1 person outside)

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