Title:
【発明の名称】銅を被着した有機重合基板を含む電子部品の製造方法、及びその有機重合基板を含む電子部品
Document Type and Number:
Japanese Patent JP2982851
Kind Code:
B2
Abstract:
A copper layer is coated onto an organic polymeric substrate in the presence of a gas containing nitrogen and a noble gas.
Inventors:
KIMU JOSEFU BURATSUKUERU
ARAN ROBAATO NOORU
RUISU JIIZASU MATEIENZO
ARAN ROBAATO NOORU
RUISU JIIZASU MATEIENZO
Application Number:
JP34099593A
Publication Date:
November 29, 1999
Filing Date:
December 10, 1993
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
C23C14/14; C23C14/20; H01L21/60; H05K3/16; H05K3/38; (IPC1-7): C23C14/20; C23C14/14; H01L21/60
Domestic Patent References:
| JP3257840A | ||||
| JP5622331A | ||||
| JP2163365A | ||||
| JP5287501A | ||||
| JP4346651A | ||||
| JP61164295A | ||||
| JP387355A | ||||
| JP5230643A | ||||
| JP5251511A | ||||
| JP382750A | ||||
| JP59168932A | ||||
| JP57162491A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)