Title:
【考案の名称】ボールグリッドアレー型集積回路のチップ用ソケット
Document Type and Number:
Japanese Patent JP3027977
Kind Code:
U
Inventors:
Lee
Application Number:
JP61196U
Publication Date:
August 20, 1996
Filing Date:
February 15, 1996
Export Citation:
Assignee:
Lee
International Classes:
(IPC1-7): H01R33/76; H01L23/32; H01R13/11; H01R13/629
Attorney, Agent or Firm:
Hattori Masaki