Title:
【考案の名称】サージ防止接続器
Document Type and Number:
Japanese Patent JP3049926
Kind Code:
U
Inventors:
Lee Kenshun
Application Number:
JP1113797U
Publication Date:
June 30, 1998
Filing Date:
December 18, 1997
Export Citation:
Assignee:
Houyu Enterprise Co., Ltd.
International Classes:
(IPC1-7): H01R31/06; H01R13/719
Attorney, Agent or Firm:
Hiroyuki Ikeuchi (4 outside)
Previous Patent: 携帯電話機用シールドパッド及びそのパッドを有する携帯電話機用収容ケ...
Next Patent: HEATING DEVICE FOR THIN FILM FORMATION SUBSTRATE
Next Patent: HEATING DEVICE FOR THIN FILM FORMATION SUBSTRATE