Title:
【発明の名称】エミッタ短絡構造を有する半導体素子
Document Type and Number:
Japanese Patent JP3091771
Kind Code:
B2
Inventors:
Yoshinobu Ohtsubo
Tomoki Hidaka
Tomoki Hidaka
Application Number:
JP2562991A
Publication Date:
September 25, 2000
Filing Date:
January 24, 1991
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L29/41; H01L29/739; H01L29/74; H01L29/744; H01L29/78; H01L29/80; (IPC1-7): H01L29/74; H01L29/744; H01L29/78
Domestic Patent References:
| JP60226179A | ||||
| JP3171777A |
Attorney, Agent or Firm:
Akihide Sugimura (8 outside)