Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3096177
Kind Code:
B2
Inventors:
Kazuyuki Sugahara
Atsushi Hachisuka
Atsushi Hachisuka
Application Number:
JP28570192A
Publication Date:
October 10, 2000
Filing Date:
October 23, 1992
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/302; H01L21/3065; H01L21/316; (IPC1-7): H01L21/316; H01L21/3065
Domestic Patent References:
| JP513407A | ||||
| JP5308103A | ||||
| JP4245628A | ||||
| JP43932A | ||||
| JP4122026A | ||||
| JP4142065A | ||||
| JP3201435A | ||||
| JP3505145A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)