Title:
半導体部品のメッキポット構造
Document Type and Number:
Japanese Patent JP3177271
Kind Code:
U
Inventors:
Sublimation
Application Number:
JP2012002861U
Publication Date:
July 26, 2012
Filing Date:
May 15, 2012
Export Citation:
Assignee:
Yuu Yes Technology Co., Ltd
International Classes:
H01L21/683
Attorney, Agent or Firm:
Seishiro Suzuki