Title:
複合基板
Document Type and Number:
Japanese Patent JP3184763
Kind Code:
U
Abstract:
Disclosed is a composite substrate provided with a piezoelectric substrate, a support substrate made of spinel, and an organic adhesive layer for adhering the piezoelectric substrate and the support substrate, wherein the support substrate comprises an adhesive surface to be adhered to the piezoelectric substrate and the adhesive surface has an Rt (maximum cross sectional height of a roughness curve) of 5 nm or more and 50 nm or less.
Inventors:
Kenji Suzuki
Application Number:
JP2013600008U
Publication Date:
July 18, 2013
Filing Date:
May 27, 2011
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H03H9/25; H01L41/18; H01L41/22; H01L41/313
Attorney, Agent or Firm:
Aitec International Patent Office