Title:
【発明の名称】半導体素子搭載用基板
Document Type and Number:
Japanese Patent JP3324875
Kind Code:
B2
Inventors:
Takeshi Yamamura
Yukio Nagano
Yukio Nagano
Application Number:
JP18596694A
Publication Date:
September 17, 2002
Filing Date:
August 08, 1994
Export Citation:
Assignee:
Tokuyama Corporation
International Classes:
H05K1/02; H01L23/12; H01L23/15; H05K3/34; (IPC1-7): H01L23/12
Domestic Patent References:
| JP3232296A |