Title:
【発明の名称】半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JP3336136
Kind Code:
B2
Inventors:
Nobuyuki Ito
Shin Matsuda
Shin Matsuda
Application Number:
JP30472094A
Publication Date:
October 21, 2002
Filing Date:
December 08, 1994
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H05K3/34; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2248066A | ||||
| JP897325A | ||||
| JP685103A | ||||
| JP4269834A | ||||
| JP6112354A |