Title:
【発明の名称】半導体封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP3359534
Kind Code:
B2
More Like This:
Inventors:
Ken Ohta
Application Number:
JP8173197A
Publication Date:
December 24, 2002
Filing Date:
March 31, 1997
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K3/00; C08G59/20; C08G59/32; C08G59/40; C08G59/62; C08K5/54; C08K5/5419; C08K5/5435; C08L63/00; C08L63/04; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/62; C08K5/5435; C08L63/04
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