Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3374812
Kind Code:
B2
Inventors:
Takashi Tanaka
Application Number:
JP31942799A
Publication Date:
February 10, 2003
Filing Date:
November 10, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L23/12; H01L21/60; H01L23/02; (IPC1-7): H01L23/12; H01L23/02
Domestic Patent References:
| JP10200018A | ||||
| JP917827A |
Attorney, Agent or Firm:
Takao Maruyama