Title:
【発明の名称】研磨体、平坦化装置、半導体デバイス製造方法、および半導体デバイス
Document Type and Number:
Japanese Patent JP3374814
Kind Code:
B2
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Inventors:
Akira Ishikawa
Tatsuya Chiga
Tatsuya Chiga
Application Number:
JP34505899A
Publication Date:
February 10, 2003
Filing Date:
December 03, 1999
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
B24B37/013; B24B37/12; B24D7/12; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP7235520A | ||||
| JP97985A | ||||
| JP10125634A |