【発明の名称】半導体チップ及びこれを用いた半導体装置

Title:

【発明の名称】半導体チップ及びこれを用いた半導体装置

Document Type and Number:

Japanese Patent JP3377787

Kind Code:

B1

Inventors:

Yuji Kikuchi
Seiji Kishimoto
Kazunari Nakagawa
Yoshiharu Hino

Application Number:

JP2002165858A

Publication Date:

February 17, 2003

Filing Date:

June 06, 2002

Export Citation:

Assignee:

Hitachi Maxell, Ltd.

International Classes:

G06K19/077; G06K19/07; H01L21/822; H01L23/12; H01L27/04; (IPC1-7): H01L21/822; G06K19/07; G06K19/077; H01L23/12; H01L27/04

Domestic Patent References:

JP10162112A
JP2000137779A

Attorney, Agent or Firm:

Kenjiro Take

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