Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3384158
Kind Code:
B2
Inventors:
Masayoshi Ohmura
Application Number:
JP32760194A
Publication Date:
March 10, 2003
Filing Date:
December 28, 1994
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L23/522; H01L21/265; H01L21/336; H01L21/768; H01L21/8238; H01L27/092; H01L29/78; (IPC1-7): H01L21/768; H01L21/265; H01L21/336; H01L21/8238; H01L27/092; H01L29/78
Domestic Patent References:
| JP5183160A | ||||
| JP4196420A | ||||
| JP4225568A | ||||
| JP4196417A | ||||
| JP60127755A |
Attorney, Agent or Firm:
Keishiro Takahashi (1 person outside)