Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP3567227
Kind Code:
B2
Inventors:
Shinji Tojo
Seiichi Ichihara
Hiroshi Koyama
Koji Akimoto
Seiichi Ichihara
Hiroshi Koyama
Koji Akimoto
Application Number:
JP24936496A
Publication Date:
September 22, 2004
Filing Date:
September 20, 1996
Export Citation:
Assignee:
Renesas Technology Corp.
Hitachi Super LSI Systems Co., Ltd.
Hitachi Super LSI Systems Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP53119669A | ||||
| JP8236584A | ||||
| JP6085009A | ||||
| JP4343237A |
Attorney, Agent or Firm:
Yamato Tsutsui