電磁妨害シールドおよびシールド方法

Japanese Patent JP3576061

B2

A storage enclosure is provided for electrical/electronic components. The storage enclosure includes an enclosure, an EMI barrier, air flow inlet apertures and exhaust air flow apertures. The enclosure has at least one wall configured to house an electrical/electronic component. The EMI barrier wall has air flow apertures sized sufficiently small to prevent passage of undesirable relatively high frequency EMI/RFI emissions. The barrier wall is supported internally of the enclosure and is configured to subdivide the enclosure into a component enclosure and a cooling fan module enclosure. The air flow inlet apertures are provided in the component enclosure to draw cooling air into the component enclosure and cool components contained therein. The exhaust air flow apertures are sized larger than the EMI barrier apertures and the air flow inlet apertures, and are provided in the cooling fan module enclosure to expel cooling air from the cooling fan module out of the storage enclosure. The component enclosure is configured to contain relatively high frequency EMI/RFI emissions that emanate from components contained therein, and the cooling fan module enclosure is configured to contain relatively low frequency EMI/RFI emissions that emanate from a fan module contained therein while providing for a relatively large passage of cooling air from the storage enclosure. A method is also provided.

Mike Strikler

JP2000025735A

October 13, 2004

February 02, 2000

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HEWLETT-PACKARD COMPANY

H05K7/20; H05K9/00; (IPC1-7): H05K9/00; H05K7/20

JP5190276A
JP5072364A
JP9186478A
JP5062099U
JP6260789A
JP7022770A
JP11186767A
JP4008495U
JP3028587U

Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo

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