Title:
ワークフィルム及びワークフィルムを用いた多層プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP3610154
Kind Code:
B2
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Inventors:
Shinji Heifun
Application Number:
JP6549496A
Publication Date:
January 12, 2005
Filing Date:
February 26, 1996
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
G03F1/00; G03F1/68; H05K3/00; H05K3/18; H05K3/46; (IPC1-7): G03F1/08; H05K3/00; H05K3/18; H05K3/46
Domestic Patent References:
| JP58111037A |
Attorney, Agent or Firm:
Ikuo Yamanaka
Takashi Tomizawa
Akika Okado
Takashi Tomizawa
Akika Okado