Title:
配線基板の製造方法
Document Type and Number:
Japanese Patent JP3748372
Kind Code:
B2
Inventors:
Hamasaki Shunsaku
Application Number:
JP2000291095A
Publication Date:
February 22, 2006
Filing Date:
September 25, 2000
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/18
Domestic Patent References:
| JP479973B1 | ||||
| JP62179197A | ||||
| JP59200489A | ||||
| JP5091760A | ||||
| JP9219469A |