集積RF性能を備えたマルチチップモジュール

Title:

集積RF性能を備えたマルチチップモジュール

Document Type and Number:

Japanese Patent JP3941911

Kind Code:

B2

Abstract:

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Inventors:

Hashemi, Hassan
Chan, Shaw
Force, roger
McCarthy, Evan
Trin, Trang
Trang, Sui

Application Number:

JP2000596587A

Publication Date:

July 11, 2007

Filing Date:

January 27, 2000

Export Citation:

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