Title:
はんだ付け方法及び装置と回路基板の製造方法
Document Type and Number:
Japanese Patent JP3979383
Kind Code:
B2
Inventors:
Takanori Watase
Ichiro Ito
Toshihiro Miyake
Toya Makoto
Ichiro Ito
Toshihiro Miyake
Toya Makoto
Application Number:
JP2003407682A
Publication Date:
September 19, 2007
Filing Date:
December 05, 2003
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B23K1/005; H05K3/36; B23K3/00; B23K101/42
Domestic Patent References:
| JP9148037A | ||||
| JP3124368A | ||||
| JP4151844A | ||||
| JP1254383A | ||||
| JP9186448A | ||||
| JP4180693A | ||||
| JP2004342982A |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Shinozaki Masami
Masaya Nishiyama
Jun Tsuruta
Shinozaki Masami
Masaya Nishiyama