Title:
液状樹脂組成物及びそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP3995862
Kind Code:
B2
Inventors:
Yamashita Katsushi
Masahiro Wada
Masahiro Wada
Application Number:
JP2000090070A
Publication Date:
October 24, 2007
Filing Date:
March 29, 2000
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/38; C08L63/00; C08G59/62; C08K3/00; C08K7/18; H01L23/29; H01L23/31
Domestic Patent References:
| JP11256012A | ||||
| JP9165566A | ||||
| JP6206982A | ||||
| JP7278265A | ||||
| JP5020919A |