Title:
半導体パッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP4004445
Kind Code:
B2
Inventors:
Tsutomu Ouchi
Fumiaki Kamisaki
Mizuno Lab
Fumiaki Kamisaki
Mizuno Lab
Application Number:
JP2003322114A
Publication Date:
November 07, 2007
Filing Date:
September 12, 2003
Export Citation:
Assignee:
Ars Electronics Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
JP2001326295A | ||||
JP2001077273A | ||||
JP2001320007A | ||||
JP2000294719A | ||||
JP2004207275A | ||||
JP2003037236A | ||||
JP2001267482A | ||||
JP2005079372A |
Attorney, Agent or Firm:
Hirofumi Mizuno