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Patent Searching and Data


Title:
半導体パッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP4004445
Kind Code:
B2
Inventors:
Tsutomu Ouchi
Fumiaki Kamisaki
Mizuno Lab
Application Number:
JP2003322114A
Publication Date:
November 07, 2007
Filing Date:
September 12, 2003
Export Citation:
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Assignee:
Ars Electronics Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
JP2001326295A
JP2001077273A
JP2001320007A
JP2000294719A
JP2004207275A
JP2003037236A
JP2001267482A
JP2005079372A
Attorney, Agent or Firm:
Hirofumi Mizuno