Title:
半導体装置の製造方法、それに使用する樹脂基板及びテープ
Document Type and Number:
Japanese Patent JP4011178
Kind Code:
B2
Inventors:
Shunji Ichikawa
Application Number:
JP2868598A
Publication Date:
November 21, 2007
Filing Date:
February 10, 1998
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/50; H01L21/60; H01L21/56
Domestic Patent References:
| JP2010748A | ||||
| JP5102212A | ||||
| JP7029927A | ||||
| JP8250524A | ||||
| JP10116929A | ||||
| JP10209190A | ||||
| JP11011062A | ||||
| JP7007048A |
Attorney, Agent or Firm:
Toshiaki Suzuki