Title:
半導体装置
Document Type and Number:
Japanese Patent JP4012652
Kind Code:
B2
Inventors:
Tanahashi Shigeo
Application Number:
JP20818399A
Publication Date:
November 21, 2007
Filing Date:
July 22, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L25/00; H01L23/02; H01L23/12
Domestic Patent References:
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| JP7235632A | ||||
| JP1093772U | ||||
| JP61288498A | ||||
| JP4024999A | ||||
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