Title:
半導体装置の検査方法
Document Type and Number:
Japanese Patent JP4021677
Kind Code:
B2
Inventors:
Hiroshi Matsuoka
Takashi Fukumoto
Takashi Fukumoto
Application Number:
JP2002030668A
Publication Date:
December 12, 2007
Filing Date:
February 07, 2002
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
G01B11/24; H01L21/56; H01L23/50
Domestic Patent References:
| JP5090365A | ||||
| JP2002031603A | ||||
| JP10239245A | ||||
| JP9113466A | ||||
| JP2001289792A |
Attorney, Agent or Firm:
Fujio Nakamae