ボンディング装置及びボンディング方法

Title:

ボンディング装置及びボンディング方法

Document Type and Number:

Japanese Patent JP4025794

Kind Code:

B2

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Inventors:

Katsuya Ogita
Hideo Sato
Katsutoshi Kobayashi

Application Number:

JP2005228293A

Publication Date:

December 26, 2007

Filing Date:

August 05, 2005

Export Citation:

Assignee:

Casio Micronics Co., Ltd.

International Classes:

H01L21/52; B08B17/04; H01L21/304; H01L21/60

Domestic Patent References:

Attorney, Agent or Firm:

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto

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