Title:
半導体装置の製造に用いる化学機械研磨用複合粒子及びその製造方法並びにそれを用いる化学機械研磨方法
Document Type and Number:
Japanese Patent JP4041236
Kind Code:
B2
Inventors:
Hiroyuki Yano
Southern study
Noki Matsui
Katsuya Okumura
Masayuki Motonari
Masayuki Hattori
Akira Iio
Southern study
Noki Matsui
Katsuya Okumura
Masayuki Motonari
Masayuki Hattori
Akira Iio
Application Number:
JP990299A
Publication Date:
January 30, 2008
Filing Date:
January 18, 1999
Export Citation:
Assignee:
Toshiba Corporation
JSR CORPORATION
JSR CORPORATION
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP9324174A | ||||
| JP4246492A | ||||
| JP7076702A | ||||
| JP4258636A |
Attorney, Agent or Firm:
Kiyoshi Kojima