電子部品の実装装置および実装方法 - Matsushita Electric Industrial Co., Ltd

Title:

電子部品の実装装置および実装方法

Document Type and Number:

Japanese Patent JP4056649

Kind Code:

B2

More Like This:

WO/2021/010033	SETUP CHANGE WORK SUPPORT METHOD AND SETUP CHANGE WORK SUPPORT DEVICE
JP2009130160	COMPONENT MOUNTING DEVICE AND RETOOLING OPERATION ASSISTING METHOD

Inventors:

Hideki Kado
Kazuhiko Nakahara

Application Number:

JP2583599A

Publication Date:

March 05, 2008

Filing Date:

February 03, 1999

Export Citation:

Assignee:

Matsushita Electric Industrial Co., Ltd

International Classes:

H05K13/02

Domestic Patent References:

Attorney, Agent or Firm:

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

Previous Patent: トンネルの構築工法

Next Patent: センター入り油脂性食品の製法およびそれに用いる装置