Title:
配線基板の製造方法
Document Type and Number:
Japanese Patent JP4070189
Kind Code:
B2
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Inventors:
Shogo Matsuo
Hamasaki Shunsaku
Hamasaki Shunsaku
Application Number:
JP2002214395A
Publication Date:
April 02, 2008
Filing Date:
July 23, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/28; H05K3/46
Domestic Patent References:
| JP2001291956A | ||||
| JP2000277878A | ||||
| JP832211A |