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Title:
スチレン系樹脂発泡板及びその製造方法
Document Type and Number:
Japanese Patent JP4073300
Kind Code:
B2
Abstract:

To provide a styrenic resin foamed board which excels in heat insulating properties and flame retardance and is suitably used as a constructional heat insulating material and the like.

The styrenic resin foamed board is obtained by extrusion foaming from an extruder, and the cells are mainly constituted of small diameter cells having a cell diameter in the thickness direction of ≤0.10 mm and large diameter cells having a cell diameter in the thickness direction of 0.15 mm to less than 0.30 mm, and has a ratio of the small diameter cells and the large diameter cells in the total area is ≥85% and, simultaneously, a ratio of the small diameter cells in the total area to the small diameter cells and the large diameter cells in the total area of 30-80% in the cross-sectional area cut in the thickness direction crossing in right angles to the extrusion direction, and furthermore has an amount of butane present in the foamed board 30 days after extrusion foaming is 1.5 wt.% to less than 3.0 wt.%.

COPYRIGHT: (C)2004,JPO


Inventors:
Nimura direct
Tsuneo Doi
Application Number:
JP2002341778A
Publication Date:
April 09, 2008
Filing Date:
November 26, 2002
Export Citation:
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Assignee:
Sekisui Plastics Co., Ltd.
International Classes:
C08J9/14; B29C47/00; C08K3/34; C08K5/02; C08L25/04; B29K25/00; B29K105/04; B29K105/16; B29K309/10; B29L7/00
Domestic Patent References:
JP2002030174A
Attorney, Agent or Firm:
Takuya Yamamoto