Title:
多層プリント基板の内層パターン位置検出方法およびその装置
Document Type and Number:
Japanese Patent JP4080127
Kind Code:
B2
Inventors:
Hideyuki Sumiyoshi
Yoshihisa Osaka
Yoshihisa Osaka
Application Number:
JP2000032321A
Publication Date:
April 23, 2008
Filing Date:
February 09, 2000
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
B26D5/30; B26F1/00; B23Q17/22; B26F1/16; H05K3/46
Domestic Patent References:
| JP62241699A | ||||
| JP10049286A | ||||
| JP2083721A |
Attorney, Agent or Firm:
Kenjiro Take