Title:
半導体集積回路
Document Type and Number:
Japanese Patent JP4080696
Kind Code:
B2
Inventors:
Shintaro Hayashi
Kazuyoshi Muraoka
Kazuyoshi Muraoka
Application Number:
JP2001005114A
Publication Date:
April 23, 2008
Filing Date:
January 12, 2001
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G11C11/413; H03K17/22; G11C11/407; G11C11/4074; G11C16/06; H01L21/822; H01L27/04; H03K17/687
Domestic Patent References:
| JP2000134076A | ||||
| JP11145808A | ||||
| JP10214121A | ||||
| JP1228215A | ||||
| JP10222234A | ||||
| JP7312541A | ||||
| JP9282880A | ||||
| JP2000075944A | ||||
| JP5127763A | ||||
| JP8223017A |
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai