Title:
パターン状薄膜層の形成方法
Document Type and Number:
Japanese Patent JP4086218
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a patterned thin-film layer by a lift-off technology with which productivity and yield are improved, and in general, mass production cost is reduced. SOLUTION: A method of forming a patterned thin-film layer by forming a mask layer for lifting off a specified pattern on an electrically insulating films substrate, forming a thin-film layer of a specified pattern extending both on the substrate and the mask layer, and peeling off the mask layer from the interface with the substrate to remove the mask layer and the thin-film layer positioned on the mask layer (lift-off layer 10), thus forming a thin-film layer of a desired pattern. The lift-off layer 10 is, for example, scanned with a suctioning head 20 of a vacuum suction machine 21 having a suctioning head to suck and peel off the lift-off layer 10.
Inventors:
Horiguchi Michiko
Yaichiro Hori
Yaichiro Hori
Application Number:
JP30826099A
Publication Date:
May 14, 2008
Filing Date:
October 29, 1999
Export Citation:
Assignee:
Fuji Electric Advanced Technology Co., Ltd.
Dai Nippon Printing Co.,Ltd.
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L31/04
Domestic Patent References:
| JP10012904A | ||||
| JP4005888A | ||||
| JP10233517A | ||||
| JP10275920A | ||||
| JP3019378A | ||||
| JP2000156515A | ||||
| JP2000077690A | ||||
| JP2000031514A |
Attorney, Agent or Firm:
Iwao Yamaguchi
Kiyoshi Matsuzaki
Kiyoshi Matsuzaki